The syllabus of the entrance test will contain two parts. Part A will be common for all the programs and part B will be discipline specific.

Part A (Common for all the programs)

Types of data, description of data, frequency distributions, bar, pie charts, graphs, mean, median. mode, standard deviation, error bars, dependent and independent variables, discrete and continuous random variables, probability, sample space, outliers, statistical inference, standard normal distribution, statistical significance, chi square test, comparing data, correlations, curve fitting' This part shall contain questions-pertaining to General Aptitude with emphasis on logical reasoning, graphical analysis. analytical and numerical ability. quantitative comparison, series formation, puzzles etc.

Part B – Subject SpeApplications)

Computer Science and Engineering/Applications)

• Digital Logic: Boolean algebra. Combinational and sequential circuits. Minimization. Number representations and computer arithmetic (fixed and floating point).
• Computer Organization and Architecture: Machine instructions and addressing modes. ALU, data-path and control unit. Instruction pipelining, pipeline hazards. Memory hierarchy: cache, main memory and secondary storage;
• Programming and Data Structures: Programming in C. Recursion. Arrays, stacks, queues, linked lists, trees, binary search trees, binary heaps, graphs.
• Algorithms: Searching, sorting, hashing. Asymptotic worst case time and space complexity. Algorithm design techniques: greedy, dynamic programming and divide-and-conquer. Graph traversals, minimum spanning trees, shortest paths
• Theory of Computation: Regular expressions and finite automata. Context-free grammars and push-down automata. Regular and context-free languages
• Compiler Design: Lexical analysis, parsing, syntax-directed translation. Runtime environments. Intermediate code generation. Local optimisation, common subexpression elimination.
• Operating System: System calls, processes, threads, inter-process communication, concurrency and synchronization. Deadlock. CPU and I/O scheduling. Memory management and virtual memory.
• Databases: ER-model, Relational model (Relational algebra, Tuple calculus), Integrity constraints, Normal Forms- 1 NF, 2 NF, 3 NF and BCNF, Query languages (SQL), Transactions and concurrency control.
• Software Engineering: Software Process, Modeling Languages, Requirement and feasibility analysis, Process Models, Planning and managing the project, Domain specific modeling, Software architecture and design patterns, Software reliability and testing techniques.

Electronics and Communication Engineering

• Network Theory: Node Analysis, Mesh Analysis, Superposition Theorem, Thevenin’s Theorem, Norton’s Theorem, Maximum Power Transfer Theorem, Reciprocity Theorem, Wye-Delta Transformation, Two Port Network Parameters, Steady State Analysis of R,L,C, Circuits
• Analog Electronics: Intrinsic and Extrinsic Semiconductors, Energy bands, Diffusion and Drift Currents, Mobility, Equation of Continuity, P-N Junction diode, Zener Diode, Light Emitting Diode (LED), Photodiode, Clipping and Clamping Circuits, Rectifiers, Filters, BJTs & MOSFETs with their Biasing and Small Signal Analysis, Op-amp Circuits and their Applications like Adder, Integrator, Differentiator and Differential Amplifier
• Digital Circuits: Number System, Boolean Algebra, Logic Gates, K-Map, Multiplexers, Demultiplexers, Encoders, Decoders, Code Converters, Flip-Flops, Counters, Registers, ADCs and DACs, Computer Organization: Addressing Modes, Internal Architecture of 8085 Microprocessor, Pipelining, Virtual Memory, Cache Memory and Mappings.
• Signals and Systems: Classification of Signals, Classification of various Systems, LTI Systems, Impulse Response, Poles and Zeros, Convolution and Correlation, Fourier Series, Fourier Transform, DTFT, DFT, Z-Transform, Laplace Transform, Sampling Theorem, FIR and IIR Filters, Multi-rate Digital Signal Processing
• Communication Systems: Amplitude Modulation and Demodulation, Angle Modulation and Demodulation 1, Noise, Noise Figure, White Noise, Random Variables and Processes, Power Spectral Density, Entropy, Channel Capacity, Error Detection and Correcting Codes, Cyclic Codes, Multiple Access Techniques, PCM, DPCM, Line Coders, DM, ADM, ASK, FSK, PSK, QAM, Intersymbol Interference, Matched Filter, Gram Schmitt Orthogonality
• Electromagnetic Theory: Gauss’s Law in Electrostatics and Magnetostatics, Boundary Conditions for Dielectrics, Faraday’s Law of EM Induction, Ampere’s Law, Maxwell’s Equations and their Differential & Integral Forms, Wave Equations, Poynting Theorem
  Uniform Plane Waves, Reflection and Refraction, Phase Velocity, Group Velocity, Wave Propagation in Conductors and Dielectrics, Depth of Penetration
  Transmission Line Equations, Impedance Matching, Smith Chart
• Control Systems: Open Loop and Closed Loop Systems, Transfer Function, Block Diagram Reduction and Signal Flow Graphs, Routh-Hurwitz Criterion, Bode Plot, Root Locus Plot, Polar Plot, Nyquist Stability Criterion, Lag, Lead and Lag-Lead Compensators, State variables, State Equations and their Solutions

Mechanical Engineering

• Production Engineering: Metal Cutting, Metal Forming, Welding, Metal Casting, Material  Characterization, Non-traditional Manufacturing Processes, Measurements & Metrology, Grinding of  Ceramics  and  Metal  Matrix  Composites, Powder Metallurgy, Microcellular Injection Moulding, Finite Element Applications in Manufacturing, CAD/CAM, Rapid Prototyping, Manufacturing  Automation,  Additive manufacturing, Laser material processing,
• Fluid Mechanics and Thermal Sciences Fluid Mechanics: Fluid properties; fluid statics, manometry, buoyancy, forces on submerged bodies, stability of floating bodies; control-volume analysis of mass, momentum and energy; fluid acceleration; differential equations of continuity and momentum; Bernoulli’s equation; dimensional analysis; viscous flow of incompressible fluids, boundary layer, elementary turbulent flow, flow through pipes, head losses in pipes, bends and fittings.
• Heat-Transfer: Modes of heat transfer; one dimensional heat conduction, resistance concept and electrical analogy, heat transfer through fins; unsteady heat conduction, lumped parameter system, Heisler's charts; thermal boundary layer, dimensionless parameters in free and forced convective heat transfer, heat transfer correlations for flow over flat plates and through pipes, effect of turbulence; heat exchanger performance, LMTD and NTU methods; radiative heat transfer, Stefan- Boltzmann law, Wien's displacement law, black and grey surfaces, view factors, radiation network analysis.
• Thermodynamics: Thermodynamic systems and processes; properties of pure substances, behaviour of ideal and real gases; zeroth and first laws of thermodynamics, calculation of work and heat in various processes; second law of thermodynamics; thermodynamic property charts and tables, availability and irreversibility; thermodynamic relations.
• Applied Thermal Engineering: Air and gas compressors; vapour and gas power cycles, concepts of regeneration and reheat. I.C. Engines: Air-standard Otto, Diesel and dual cycles. Refrigeration and air-conditioning: Vapour and gas refrigeration and heat pump cycles; properties of moist air, psychrometric chart, basic psychrometric processes. Turbomachinery: Impulse and reaction principles, velocity diagrams, Pelton-wheel, Francis and Kaplan turbines
• Engineering Materials: Structure and properties correlation; engineering materials (metals, ceramics, polymers and composites) – properties and applications; stress-strain behaviour of metals and alloys; iron-carbon phase diagram, heat treatment of metals and alloys, its influence on mechanical properties, stress-strain diagrams for engineering materials.
• Mechanics of Materials: Stress and strain, elastic constants, Poisson's ratio; failure theories; Mohr’s circle for plane stress and plane strain; thin cylinders; shear force and bending moment diagrams; bending and shear stresses; deflection of beams; torsion of circular shafts; Euler’s theory of columns; energy methods; thermal stresses; strain gauges and rosettes; testing of materials with universal testing machine; testing of hardness and impact strength.
• Theory of Machines: Displacement, velocity and acceleration analysis of plane mechanisms; dynamic analysis of linkages; cams; gears and gear trains; flywheels and governors; balancing of reciprocating and rotating masses; gyroscope. governors and fly wheels; design of bolted, riveted and welded joints; interference/shrink fit joints; design of shafts, keys, spur gears, belt drives, brakes and clutches; pressure vessels. Vibrations: Free and forced vibration of single degree of freedom systems, effect of damping; vibration isolation; resonance; critical speeds of shafts.
• Machine Design: Design for static and dynamic loading; failure theories; fatigue strength and the S-N diagram; principles of the design of machine elements- bolted, riveted and welded joints; shafts, gears, rolling and sliding contact bearings, brakes and clutches, springs.
• Industrial Engineering: Quality, Reliability and Maintenance, Lean Manufacturing, Time study, Motion study, Agile Manufacturing, Statistical quality control, Operations Management, Project Management,  Supply  Chain  Management, Reverse Logistics, Inventory management
• Operations Research:  Linear Optimization Models, Assignment and Transportation Models, Queuing Theory, CPM/PERT

Computer Science and Engineering

Electronics and Communication Engineering

Mechanical
Engineering

1. The research scholars will be provided with Teaching-cum-Research Fellowship as per UGC guidelines. The award of fellowship shall be reviewed every semester, based on the performance report provided by the respective Department Research Committee on recommendation of the Research Advisory Committee. 
2. The duration of the fellowship is normally for four years and shall be extended for a maximum period of one year by the competent authority.
3. Continuation of the fellowship is subject to satisfactory research performance and satisfactory academic performance in the discharge of responsibilities assigned to the research scholar. 
4. The admission to the program and award of fellowship are not linked. Admission to any program does not guarantee the award of the fellowship. Those who are not awarded fellowships can continue with the program as self-financing scholars.
5. The fellowship shall be paid monthly. The research scholar with fellowship would be expected to contribute 8 hours per week to the university through designated teaching assistance, laboratory, assignments, and other work of academic nature and requirement.
6. Travel and contingency grants will be allowed to the scholars as per university norms

1. All the research scholars shall be required to take course work as prescribed by the university during the first two semesters.
2. The credits requirement for the Ph.D. course work shall be:
1. A minimum of 20 credits for scholars with an acquired master’s degree.
2. A minimum of 32 credits for scholars with an entry after a 4-year bachelor’s degree.
3. Eight credits must be acquired through courses on
   • Research Design, Thinking and Methodology (4 credits)
   • Philosophy of Science (2 credits)
   • Seminar (2 Credits) which could cover areas such as quantitative methods, computer applications, research ethics, review of published research in the relevant field, training, field work, writing research papers, etc. Other courses shall be advanced level courses preparing the scholar for Ph.D. degree.
4. In special cases, for students with advance standing by virtue of their academic preparedness and/or by virtue of research publications and/or by virtue of their professional work experience, some of the course work requirements may be waived. All such waivers shall be decided upon by the DRC on the recommendation of the academic advisor.
3. Candidates already holding a M Phil degree from any recognized university/institution and admitted to the Ph.D. program, may be exempted by the Department Research Committee from the Ph.D. course work. 
4. A Ph.D. scholar must obtain a minimum of 60% marks in each of the courses taken in order to be eligible to continue in the program and submit the thesis. If the marks obtained by any scholar in the prescribed course work are below the required marks, the research scholar has to take up additional courses to bring up the marks equal to or above 60% marks in each of the courses taken in order to be eligible to continue in the programme and submit the thesis.

*The timeline for scholars, for coursework, comprehensive evaluation, and proposal defense, with undergraduate degrees will be six months more than the candidates with master’s degree.

1. Annual fee is Rs. 10,000/- which is to be paid at the beginning of each year. 
2. A onetime sum of Rs. 20,000/- as caution money will be charged from each student seeking admission to the university in the Academic Year 2022-23. This amount is interest free and will be refunded to the students at the time of withdrawal or at end of their Programme, whichever is later, after deduction of dues, if any.
3. The amount of program fee/other charges deposited by the student may not be refunded if the candidate does not join the programme or leave the university and intimate the same after the last date of registration.
4. Fee refund shall be done as per the University policy.